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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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IPC Releases Newest List of Standards Updates, Revisions
June 3, 2024 | IPCEstimated reading time: Less than a minute

Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2.
IPC-7711/21D
Rework, Modification and Repair of Electronic Assemblies
IPC-7711/21D provides guidance on procedures for rework, repair, and modification of printed board and cable or wire harness assemblies. IPC-7711/21D provides the requirements, tools, and materials to be used in the rework, repair, and modification of electronic products and for cable or wire harness assemblies.
IPC-2221C
Generic Standard on Printed Board Design
IPC-2221C establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with organic materials; the interconnections may be single, double, or multilayered.
To find out the rest of the newest standards, which were published in the Spring 2024 issue of IPC Community, click here.
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