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Marcy’s Musings: All Things Material Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges
June 4, 2024 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.
For over two decades, Koh Young has been a global leader in the field of 3D inspection and measurement technology. Our journey began with a vision to enhance precision and efficiency in electronics manufacturing. Today, we stand at the forefront of revolutionizing the semiconductor industry with our innovative metrology solutions. Using our True3D™ measurement-based inspection technologies, including the ZenStar and Meister Series, manufacturers can tackle critical manufacturing challenges in advanced packaging. These technologies provide real-time insights and predictive analytics to drive smarter manufacturing decisions, achieve higher yields, reduce defects, and improve overall productivity.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement.
- High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
- 10-micron Thins Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Reflective, Shiny Die
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- Height and Tilt Measurement in High Density, Highly Reflective Applications
ZenStar True 3D Measurement for Wafer-level Packaging Applications
Combining innovative vision algorithms and high-resolution optical technology, the ZenStar inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading metrology capabilities with deep learning technology
- 10-micron diameter wafer bump inspection
- Full 3D height and tilt measurement for even highly reflective die surfaces
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