Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
Zero Defects International to Exhibit At SMTA Oregon Expo
June 19, 2024 | Zero Defects InternationalEstimated reading time: Less than a minute
Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Expo and Tech Forum to be held Thursday, June 20 at the Wingspan Event & Conference Center in Hillsboro, Oregon. Location of this venue is 801 NE 34th Ave., Hillsboro, Oregon.
Foremost among the PCBA test and inspection products to be shown will be Viscom's AOI, X-Ray and SPI inspection equipment. The Viscom display will include updates on the very latest enhancements for each of these products. Also featured will be Europlacer's PCBA surface mount equipment.
Additionally, ZDI will have information on their flying-probe test services as well as reverse engineering and failure analysis services. Those attending include Michaela Brody, President and Paul Benke, CEO. Other ZDI partners, for which information will be available include Velan, Tagarno and Epoch International.
Share on:
Suggested Items
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.
$1 Million Awarded to Galvanize Workforce with Electronics Education
05/05/2025 | University of ArkansasThe Arkansas Department of Higher Education awarded the University of Arkansas $1 million to expand electronics education through development of credit and non-credit courses related to workforce needs in the semiconductor industry.
Cadence Enables Next-Gen AI and HPC Systems with Industry’s Fastest HBM4 12.8Gbps IP Memory System Solution
04/21/2025 | Cadence Design SystemsCadence announced the industry’s fastest HBM4 12.8Gbps memory IP solution, which meets the increasingly higher memory bandwidth needs of SoCs targeted for the next generation of AI training and HPC hardware systems.
IPC APEX EXPO 2025: And So It Begins
03/18/2025 | Nolan Johnson, I-Connect007The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.
Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025
03/17/2025 | Hentec Industries/RPS AutomationThe Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).