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New Information Now Available for Popular Podcast Series on PCB Design

10/24/2024 | I-Connect007
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.

I-Connect007 Launches Latest Podcast Series: Meet the Author

10/09/2024 | I-Connect007
In the first episode of our Meet the Author series, SMT007 Magazine’s Nolan Johnson hosts Julie Cliche-Dubois, product manager at Cogiscan, and Andres Luna, general manager at Univertools, who represents Cogiscan in Mexico. Julie is the author of the recently published book, "The Printed Circuit Assembler's Guide to... Factory Analytics.” In this episode, the group discusses the evolving role of data analytics, with an eye toward how analytics is driving meaningful action throughout the electronics manufacturing industry in Mexico and the rest of the Americas.

Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone

09/04/2024 | I-Connect007
Don't miss the latest episode of "On the Line with… ASC Sunstone: Designing for Reality," in which ASC Sunstone’s General Manager, Matt Stevenson, discusses the critical topic of surface finishes in PCB manufacturing.

Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content

08/08/2024 | Indium Corporation
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 3

08/07/2024 | I-Connect007 Editorial Team
In this chapter, readers learn about the use of HRL3 alloy in solder joints to balance strength and ductility. Test results show improved performance with HRL3 alloy compared to traditional low-temperature solders.
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