-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Sypris Appoints Michael D. Sedgwick as Vice President and General Manager of Sypris Electronics
June 5, 2024 | Sypris Solutions Inc.Estimated reading time: 1 minute
Sypris Solutions, Inc. announced the appointment of Michael D. Sedgwick to the position of Vice President and General Manager of Sypris Electronics, LLC, effective June 3, 2024. Mr. Sedgwick will operate from the Company’s headquarters located in Tampa, Florida and will report to Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, Inc.
Mr. Sedgwick will be joining Sypris following a successful career with SCI Technology, Inc., a division of Sanmina Corporation, where he most recently served as the Vice President of Defense and Aerospace Products and was responsible for the company’s product portfolio and electronics manufacturing services with annual sales in excess of $180 million per year.
Prior to his last assignment with SCI Technology, Inc., Mr. Sedgwick served in a number of increasingly responsible senior-level positions with I3, Abaco Systems Inc. and AAR Corporation. Mr. Sedgwick began his career with SCI Technology, Inc. in 2007 as its Senior Program Manager for the Defense and Aerospace Division, and as Director of Aircraft Systems from 2010 to 2014.
From 2005 to 2007, Mr. Sedgwick served in the U.S. Army as a Battalion Intelligence Officer (S-2) for the 10th Special Forces Group (Airborne) operating in Iraq. From 2001-2005, Mr. Sedgwick served as an Infantry Officer for the 82nd Airborne Division in Afghanistan and Iraq, where he conducted over 100 combat patrols. Since 2007, he has continued to serve as a member of the U.S. Army Reserve.
Mr. Sedgwick’s breadth of experience includes leading business segments serving the U.S. Department of Defense, prime government contractors, and the commercial aerospace market with responsibility over IR&D, Business Development, Sales and Marketing, and Project and Program Management.
Commenting on the announcement, Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, said, “We are very pleased to announce the addition of Mike to the Sypris team. His extensive experience, industry knowledge and successful track record will be invaluable in the continued development of Sypris Electronics into a larger, increasingly profitable company.”
Suggested Items
Kimball Electronics Thailand Namlee School
12/26/2024 | Kimball ElectronicsKimball Electronics Thailand (KETL) has continued its commitment to supporting education and community development in Thailand.
Diverging Electrification Goals between Honda and Nissan; Accelerated Resource Integration will be the Top Priority Post-Merger
12/25/2024 | TrendForceHonda and Nissan—two of Japan’s largest automakers—announced on December 23rd, 2024, that they have entered into merger negotiations, with plans to finalize an agreement by June 2025. Mitsubishi Motors is also expected to join the partnership.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.