-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Sypris Appoints Michael D. Sedgwick as Vice President and General Manager of Sypris Electronics
June 5, 2024 | Sypris Solutions Inc.Estimated reading time: 1 minute

Sypris Solutions, Inc. announced the appointment of Michael D. Sedgwick to the position of Vice President and General Manager of Sypris Electronics, LLC, effective June 3, 2024. Mr. Sedgwick will operate from the Company’s headquarters located in Tampa, Florida and will report to Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, Inc.
Mr. Sedgwick will be joining Sypris following a successful career with SCI Technology, Inc., a division of Sanmina Corporation, where he most recently served as the Vice President of Defense and Aerospace Products and was responsible for the company’s product portfolio and electronics manufacturing services with annual sales in excess of $180 million per year.
Prior to his last assignment with SCI Technology, Inc., Mr. Sedgwick served in a number of increasingly responsible senior-level positions with I3, Abaco Systems Inc. and AAR Corporation. Mr. Sedgwick began his career with SCI Technology, Inc. in 2007 as its Senior Program Manager for the Defense and Aerospace Division, and as Director of Aircraft Systems from 2010 to 2014.
From 2005 to 2007, Mr. Sedgwick served in the U.S. Army as a Battalion Intelligence Officer (S-2) for the 10th Special Forces Group (Airborne) operating in Iraq. From 2001-2005, Mr. Sedgwick served as an Infantry Officer for the 82nd Airborne Division in Afghanistan and Iraq, where he conducted over 100 combat patrols. Since 2007, he has continued to serve as a member of the U.S. Army Reserve.
Mr. Sedgwick’s breadth of experience includes leading business segments serving the U.S. Department of Defense, prime government contractors, and the commercial aerospace market with responsibility over IR&D, Business Development, Sales and Marketing, and Project and Program Management.
Commenting on the announcement, Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, said, “We are very pleased to announce the addition of Mike to the Sypris team. His extensive experience, industry knowledge and successful track record will be invaluable in the continued development of Sypris Electronics into a larger, increasingly profitable company.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.