-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
June 5, 2024 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
Indium Corporation is a leading solder supplier for laser and optical applications. Gold-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s gold-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- Highly accurate solder volume and BLT control
- Precision edge quality
- Flat and free of warping or bends
- Optimized cleanliness control
- Default waffle-pack method
Indium Corporation’s gold PDA preforms are available in the following primary and development alloys:
Primary alloys:
- 80Au/20Sn
- 79Au/21Sn
Development alloys:
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96.8Au/3.2Si
- 82Au/18In
Indium Corporation’s AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition, and improving wetting and voiding. The AuLTRA® product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
Indium Corporation’s AuLTRA® ThInFORMS® are 0.00035”-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS® help combat common issues such as:
- Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness (BLT), thus improving thermal transfer and increasing the longevity and performance of the device
Indium Corporation’s AuLTRA® Fine Ribbon is our Indalloy®182 fine-grade precision ribbon, for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
A leading gold solder innovator, Indium Corporation’s gold-based portfolio includes wire, paste, preforms, spheres, shot, and ribbon manufactured with cutting-edge technology to ensure supreme quality and the utmost precision. The most commonly used gold-based alloy is 80Au/20Sn: the pillar alloy of the microelectronics industry with a melting point of 280°C, 80Au/20Sn works great in the majority of die-attach and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications that require high tensile strength and high corrosive resistance. Indium Corporation’s AuSn solder offers numerous benefits including:
- Highest tensile strength of any solder
- High melting point compatible with subsequent reflow processes
- Superior thermal conductivity
- Resistance to corrosion
Suggested Items
Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors
10/24/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel® Core™ Ultra 200V series.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
10/22/2024 | StratEdgeStratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).
Würth Elektronik Expands Ferrite Range for Electromobility Applications
10/22/2024 | Wurth ElektronikWith the WE-OEFA-LFS ferrite, Würth Elektronik is releasing an oval-shaped ferrite ring for interference suppression at low frequencies.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.