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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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STMicroelectronics Completes Acquisition of NXP’s MEMS Business
February 3, 2026 | STMicroelectronicsEstimated reading time: Less than a minute
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business. Announced in July 2025 and now fully approved by regulators, this transaction, focused on automotive safety and non-safety products and sensors for industrial applications, expands ST’s global sensors capabilities.
Based on our initial assessment, we expect the acquired business to contribute in the mid forties million dollars range to ST’s revenues in the first quarter of 2026.
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Fujitsu Develops High-Resolution Infrared Sensor for Defense and Disaster Monitoring
03/27/2026 | JCN NewswireFujitsu announced the development of a world-leading, high-sensitivity and high-resolution infrared sensor to expand monitoring capabilities in the defense and disaster prevention fields.
STMicroelectronics Accelerates Global Adoption and Market Growth of Physical AI with NVIDIA
03/17/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the acceleration of global development and adoption of physical AI systems, including humanoid, industrial, service and healthcare robots.
Safety First: ADAS, Connectivity, and Interfaces on the Road to Reliability
03/06/2026 | Stanton Rak, SF Rak CompanyEVs function as intelligent, software-centric platforms where safety, connectivity, and user experiences are deeply intertwined. Advanced driver assistance systems (ADAS), vehicle connectivity architectures, and digital driver interfaces now play a central role in both vehicle operation and customer perception. EVs provide synergies for ADAS and connectivity because their strong electrical base provides a natural framework for integrating the advanced sensors, telematics, and high-reliability control units required for ADAS and connected systems.
LPKF Develops Glass Components for Quantum Computers in Funded QVLS-iLabs Future Cluster
02/27/2026 | LPKFLPKF Laser & Electronics is participating as a technology partner in the QVLS-iLabs future cluster, which has secured an additional €15 million in funding from the German Federal Ministry for Research, Technology and Space Travel (BMFTR) for the next three years. T
HBNU Develops Wearable Sensor to Detect Ammonia Gas
02/12/2026 | PRNewswireAmmonia (NH3)—the second-most-produced chemical globally—has proven to be highly important in furthering human civilization over the centuries, both in terms of technological capabilities and innovation potential. It is widely utilized in fertilizers, refrigerants, biomarkers, and next-generation fuel.