Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
KYZEN to Showcase Multi-Process Power Module Cleaner at SEMICON West 2024
June 10, 2024 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco. KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.
MICRONOX MX2123 is an advanced, aqueous, multi-phase cleaning solution specifically engineered to remove flux residues from a variety of IGBT module devices that utilize a combination of copper, silver and nickel DBC substrates, as well as PCBs. Its meticulously balanced formula ensures superior surface conditions for subsequent wire bonding and potting processes.
Key Features of MICRONOX® MX2123:
Exceptional Cleaning Performance: Designed to effectively eliminate flux residues, MICRONOX MX2123 ensures optimal surface conditions for critical downstream processes.
Versatile Application: Suitable for use in both Spray-In-Air in-line and Ultrasonic Immersion cleaning systems, providing flexibility for diverse manufacturing setups.
Low Temperature and Concentration Efficiency: Operates effectively at low temperatures and concentrations, reducing energy consumption and operational costs.
Enhanced Surface Preparation: Ensures exceptional surface conditions for subsequent wire bonding and potting, crucial for high-reliability applications in power devices and advanced packaging.
In addition to MICRONOX MX2123, KYZEN will also discuss its range of other high-performance cleaning solutions tailored for power devices and advanced packaging applications. The company’s experts will be available at Booth 1841 to provide insights and answer questions about their comprehensive product portfolio.
Share on:
Suggested Items
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.