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Ansys to Demonstrate 3D Multiphysics Visualization of Electromagnetic and Thermal Effects in Semiconductor Packages at Design Automation Conference

06/20/2024 | ANSYS
Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization. Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization.

Connect the Dots: Designing for Reality—Lamination and Materials

06/19/2024 | Matt Stevenson -- Column: Connect the Dots
As many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.

Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure

06/19/2024 | BUSINESS WIRE
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, today announced the successful tape-out of the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7nm process.

Raytheon-Kongsberg System is Proving Itself – In Demos and In Combat

05/16/2024 | Raytheon Technologies
On a rocky island off the coast of Norway, Michael Sadlowski watched as a surface-to-air missile launcher pointed up into a dark nighttime sky.

SAIC Awarded $232 Million U.S. Army Contract for Systems Engineering and IT Modernization Services

05/13/2024 | SAIC
Science Applications International Corp. has been awarded a $232 million contract to develop signals intelligence and electronic warfare systems for the U.S. Army. SAIC was awarded this contract under the Department of Defense Information Analysis Center’s (DoD IAC) multiple-award contract (MAC) vehicle.
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