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Alpha, Omega Semiconductor Launches SmartClamp DrMOS for AI Servers and GPUs

05/01/2026 | Alpha
Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the launch of the SmartClamp™ family of protected DrMOS.

OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment

04/29/2026 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

05/04/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Smarter AOI: Delvitech Brings Native AI to APEX EXPO

04/10/2026 | Real Time with... APEX EXPO
Marcy LaRont speaks with Delvitech founder and CEO Roberto Gatti about the company’s AI-native inspection technology and its growing global presence. Gatti explains how Delvitech’s integrated hardware and neural-network–driven platform is unique in the market with unmatched flexibility for implementation across multiple lines and multiple facilities.

Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups

03/31/2026 | Happy Holden -- Column: Happy’s Tech Talk
Multilayer stackups have evolved dramatically as they’ve been adopted for high-performance computing (HPC) and artificial intelligence (AI) server applications. These high-speed, high I/O designs require the designer and fabricator to manage more boundary conditions than ever before. In practice, the stackup is no longer “just a stackup.” It becomes the foundation for signal integrity, reliability, manufacturability, and cost.
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