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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Real Time with... SMTAI 2026: Addressing Warpage in Large Boards and AI Packages with Akrometrix

11/09/2026 | Real Time with...SMTAI
In this recent interview from SMTAI, Paul Handler explains why larger AI packages and complex circuit boards are driving tighter warpage and planarity requirements. He discusses inspection throughout the supply chain and utilizing Akrometrix equipment for fast, room temperature measurement of large boards or multiple smaller parts before production.

GÖPEL electronic Introduces New Multi Line AXI 3D-CT X-Ray Inspection System

09/03/2026 | GÖPEL electronic
For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels.

Lockheed Martin Awarded $58.6B Multiyear PAC-3 MSE Contract

08/04/2026 | Lockheed Martin
The U.S. government awarded Lockheed Martin a seven-year undefinitized contract action (UCA) modification for up to $53.86 billion for PAC-3 Missile Segment Enhancement (MSE) interceptors, supporting the Department of War's Acquisition Transformation Strategy.

DFM Mistakes Designers Make When Moving to ELIC

07/20/2026 | Anaya Vardya, American Standard Circuits
The transition from HDI to every layer interconnect (ELIC) is where the DFM gap between design intent and fabrication reality is most visible. Several common misconceptions appear consistently in the data packages we review at ASC. The most common ELIC design mistake mirrors what we generally see in first-time UHDI builds: using process minimums everywhere because they appear on a capability chart. In ELIC, this is especially consequential. If only one region truly requires aggressive geometry, say, a fine-pitch BGA escape, the rest of the design should preserve margin. Relaxing non-critical areas makes the overall build more manufacturable without sacrificing the dense region that drives the stackup.

Cadence Launches AuraStack AI Super Agent

07/16/2026 | Cadence Design Systems, Inc.
The AuraStack AI Super Agent is the world's first agentic AI platform for PCB and advanced packaging design.
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