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Is U.S. EMS Growth Real or Just Repositioning?

05/27/2026 | Nolan Johnson, SMT007 Magazine
Based on survey data, U.S. EMS providers are reporting a noticeable uptick in orders, and the narrative forming around what’s driving that growth is familiar: tariffs, reshoring, and a long-awaited revival of domestic manufacturing. Some analysts even claim we’ve entered a super-cycle, a prolonged period of demand-driven economic growth that can last years to decades. But as is often the case in this industry, the reality is more nuanced.

Alpha, Omega Semiconductor Launches SmartClamp DrMOS for AI Servers and GPUs

05/01/2026 | Alpha
Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, announced the launch of the SmartClamp™ family of protected DrMOS.

OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment

04/29/2026 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

05/04/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

Smarter AOI: Delvitech Brings Native AI to APEX EXPO

04/10/2026 | Real Time with... APEX EXPO
Marcy LaRont speaks with Delvitech founder and CEO Roberto Gatti about the company’s AI-native inspection technology and its growing global presence. Gatti explains how Delvitech’s integrated hardware and neural-network–driven platform is unique in the market with unmatched flexibility for implementation across multiple lines and multiple facilities.
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