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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. Many aspiring scientists and engineers discover that success in technical fields requires more than intelligence; it demands resilience, confidence, and a willingness to keep going when the material becomes difficult.

EIPC Summer Conference 2026: AI, Robots, and Historic Vilnius, Lithuania

06/15/2026 | Marcy LaRont, I-Connect007
Historic downtown Vilnius, Lithuania, hosted the sold-out EIPC Summer Conference, June 9–10, where 175 participants gathered at the AC Hotel, including representatives from the Global Electronics Association, FED, and four other industry associations. This year also included representation from 14 European PCB companies, and one—TTM— from the U.S., something that hasn’t happened for quite some time.

Technica USA Joins Supply Partner Agfa at TechBlick 2026

06/11/2026 | Technica USA
Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.

Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference

05/19/2026 | Global Electronics Association
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).

PCB Technologies to Exhibit at PCB East 2026

04/23/2026 | PCB Technologies Ltd.
Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
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