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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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OE-A at ICFPE 2024, Taipei, Taiwan
June 11, 2024 | OE-AEstimated reading time: Less than a minute
The International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session. The OE-A Asia Meeting will be held one day prior to the ICFPE in Taipei, August 27.
The conference ICFPE is hosted by the National Taipei University of Technology. As a partner of ICFPE, OE-A is organizing a conference session on ‘Flexible and Printed Electronics’. The OE-A session will address a variety of aspects and applications of flexible and printed electronics, such as Artificial Intelligence for Printing, Display Technology, Printing Process and Equipment, Flexible Electronic Materials and Green Energy – just to give a few examples. Dr. Alain Schumacher, CTO of IEE and Vice Chair OE-A, gives a keynote at the conference.
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Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration
09/22/2025 | Global Electronics AssociationThe Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more.
PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.
IPC Issues Call for Participation for IPC APEX EXPO 2026
06/02/2025 | IPCIPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.