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Chase Corporation Acquires Sheldahl

06/15/2026 | PR Newswire
Chase Corporation, a leading global provider of engineered materials for high-reliability applications, today announced it has acquired Sheldahl from Flex. Sheldahl designs and manufactures specialized coated films, laminates, and flexible circuit technologies for aerospace, automotive, industrial, and medical markets.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

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06/09/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced enhanced advanced packaging material solutions for organic interposer applications:

Dow Launches DOWSIL TC-3120 Thermal Gel for Optimum Heat Transfer for Optical Modules, Dense Electronics and High-speed Data Applications

06/01/2026 | Dow
Dow has announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimize heat transfers and provide optical-grade cleanliness. It has the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicone gels and is designed to minimize oil bleeding and condensed outgassing – contaminants that can reduce the reliability of optics and electronics.

Technica Tech Day Event on AI and the Large BGA Solution Hits the Mark

05/27/2026 | Technica USA
On May 13–14, 2026, Technica USA hosted its Tech Day Event in San Jose, California, bringing together more than 25 companies and over 60 attendees from across the electronics manufacturing industry. The event focused on how the rapid evolution of artificial intelligence is driving new manufacturing requirements and changing the technologies used for SMT placement, inspection, and process control.
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