Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
International Promotion of Young Talents – Rehm Thermal Systems Welcomes Dual Students from GIP CEI / ESTI in Redon, France
June 14, 2024 | Rehm Thermal SystemsEstimated reading time: 1 minute
In order to inspire qualified specialists to work in an industrial company, it is important to present yourself as a sustainable and innovative company with development opportunities: We gave students specializing in electronics, industrialization and supply chain strategy (logistics and purchasing management) an insight into the product diversity and production at Rehm Thermal Systems in Blaubeuren.
ESTI Master's students acquire in-depth knowledge in the fields of electronics, industrialization and supply chain strategy (EISC) during the theoretical phases of their studies, which is applied in practice during their time at a French company from the electronics industry, such as Safran, Thales, Sercel, Cofidur EMS, Asteelflash, éolane and Selha Group.
A five-day trip to Germany gave a small group of these students the opportunity to visit companies (ASYS, EKRA, SYSTRONIC, ZESTRON, Rehm Thermal Systems and Scheugenpflug) that manufacture equipment used in their partner companies.
On 11 April 2024, the 18 participants, accompanied by their professor and director Dr Jamal Rammal, were guests at Rehm Thermal Systems in Blaubeuren: The morning started with a mutual introduction, a general introduction to the company, a presentation of the product portfolio and seminars in small groups on the topics of application, convection soldering and condensation soldering. During a subsequent tour through the production halls, many students discovered familiar systems from the practical phases in the companies. The day was rounded off with demonstrations on systems from the Vision and Condenso Series in our Technology Centre to learn more about the advantages of reflow soldering with vacuum – a highlight for everyone involved!
We would like to thank our visitors for the pleasant exchange – perhaps we will meet again!
Next year's visit is already being planned
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).