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STI Electronics Requalifies for Four IPC Qualified Manufacturers Listings
June 18, 2024 | STI ElectronicsEstimated reading time: 1 minute
IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001, IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listings (QML). During the same requalification process, STI was also requalified as an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) Type 3 Assembler.
Commenting on STI Electronics, Inc.’s QML requalification, David Raby, president and CEO, said, “STI Electronics, Inc. unlocks the future with IPC QMLs, where rigorous standards meet innovation. Quality, reliability, and efficiency coverage propel us towards excellence in electronic manufacturing.” He continued, “We extend our deepest appreciation to IPC and Randy Cherry for their unwavering dedication to advancing the electronics industry. Their commitment to fostering standards, innovation, and collaboration continues to shape a brighter future for all.”
STI Electronics, Inc. achieved its initial IPC Validation Services QML recognition status over six years ago. With its requalification, it maintains its QML status as an IPC trusted source capable of manufacturing by industry best practices and at the highest level of quality.
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes that conform to IPC standards.
"Unlike other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes per IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize STI Electronics, Inc. for continuing to be a member of IPC's network of trusted QML suppliers for three of IPC’s foremost standards."
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Rachael Temple - AlltematedSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.