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Ansys Multiphysics Signoff Solutions Certified for Samsung’s 2nm Power Backside Delivery Technology

06/26/2024 | ANSYS
Ansys power integrity solutions have been certified by Samsung Foundry for use with Samsung’s new SF2Z 2nm gate-all-around manufacturing technology.

Ansys Stockholders Approve Transaction with Synopsys

05/24/2024 | ANSYS
Ansys announced that at the special meeting of stockholders held earlier today, its stockholders voted to approve the proposed acquisition of Ansys by Synopsys, Inc.

Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation

05/09/2024 | ANSYS
Ansys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.

Ansys Announces Q1 Financial Results

05/03/2024 | ANSYS
ANSYS, Inc. reported first quarter 2024 revenue of $466.6 million, a decrease of 8% in reported and constant currency, when compared to the first quarter of 2023.

TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

04/30/2024 | PRNewswire
Ansys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
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