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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 21, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes

He’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular. Reading Pete’s reviews is almost as good as being there. Check out his Part 1 coverage here.
Looking Into Space: EIPC Summer Conference, Part 2
Published June 18
This second-day write-up of the conference, themed, “Innovative Development of PCB Technology and Design,” kicked off with a compelling presentation by Dr. Evelyne Parmentier, research and development engineer with Dyconex, who broached the question, “Why aren’t we including more of the elements (metals) in the periodic table in our manufacturing?” This was followed by a discussion on sputtering as an alternative method of metalization, something of great interest to many of us.
American Made Advocacy: Changing Leadership and Three Years of Advocacy in D.C.
Published June 18
Travis Kelly, CEO of Isola and the first chair of PCBAA, signs off in his final column this month as he turns the PCBAA reigns over to Shane Whiteside of Summit Interconnect. Recollecting the last three years of advocacy work of which he and PCBAA have been a critical part, he highlights all that remains to be done and how important it is for business leaders to have their voices heard. As he bids Mr. Whiteside much success in this role, he calls out to all industry members to become involved in helping to create a more balanced global supply chain where U.S. businesses and interests can prosper.
Traditional Materials, High-Frequency Boards?
Published June 18
This interview with PCB design guru Kris Moyer and the former CTO for Isola Ed Kelly is an energetic and informational discussion about the evolution of PCB materials and the cross-over we are seeing today between high-speed digital designs and PCB designs for RF applications. RF materials are no longer the only go-to material solution when dealing with RF attributes in a PCB design. Today, this is the middle ground, utilizing and blending different resin systems to achieve low loss and target Dks. This is a great read.
The Critical Role of Materials
Published June 19
As a PCB fabricator, managing your inventory, especially your laminate inventory, is a critical piece for achieving and maintaining financial success in business. If you do everything else right and do this wrong, you will negatively affect your bottom line. In this article from PCB007 Magazine’s May issue, Anaya Vardya of American Standard Circuit shares his approach and best practices regarding this essential part of operations. When managing high-tech, high-mix, low-volume production, the criticality of great supplier relationships and managing necessary risk are all covered in this in-depth interview.
Manufacturing Industry's Path to Innovation and Efficiency Lies in Exponential IT, Says Info-Tech Research Group
Published June 18
Sometimes, a news item resonates deeply with our readers, and this announcement by the Info-Tech Research Group did just that. Speaking to the seemingly incessant search for good information and data that may provide clarity for our business futures, this article showcases the reality that achieving innovation is increasingly and inextricably linked to one’s investment and engagement in IT or technology. Of course, leveraging AI capabilities comes immediately to mind. “Exponential IT,” as it is called in this study, is not the IT of yesteryear. As with all things, strategy will be key in how technology will be used optimally to the greatest advantage and success of manufacturing businesses. This is a quick read focused on your IT management, but if you are a business leader or stakeholder, it is worth two minutes of your time.
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Sweeney Ng - CEE PCBSuggested Items
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032
09/04/2025 | Globe NewswireAccording to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/04/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.