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Z-AXIS Will Double Its Surface Mount Capacity
June 21, 2024 | Z-AXISEstimated reading time: 1 minute
Z-AXIS, a fast-growing provider of electronic design and manufacturing services, will double its surface mount technology (SMT) capacity during Phase 1 of a $1.5M USD expansion. The electronics contract manufacturer ordered a total of 15 new pieces of equipment after visiting the IPC APEX 2024 tradeshow this spring.
“This is the first phase of three-phase expansion,” said Michael Allen, Z-AXIS’ President. “Expanding our surface mount capabilities will allow us to take on even more SMT jobs while accelerating production,” he added.
During the first phase of its latest expansion, Z-AXIS will replace its new product introduction (NPI) line with an SMT line that is effectively as fast as its other two high-speed lines combined. The company will retain the current NPI line’s oven but add a board dropper, stencil printer, conveyor, two pick-and-place machines, a board turner, another conveyor, and automated optical inspection (AOI) technology.
Z-AXIS selected the AOI equipment based on information gained at IPC APEX 2024, the electronics manufacturing industry’s largest event in North America. Z-AXIS expanded its wire and cable assembly production in 2020 and has a rich history investing in state-of-the-art equipment. The company’s current expansion is self-funded and reflects a record number of sales bookings this year.
Suggested Items
Bridging the Gap: Re-engaging Design and Manufacturing with Downstream
06/27/2024 | Andy Shaughnessy, Design007 MagazineAt PCB East in Boxborough, Massachusetts, I caught up with Joe Clark, co-founder of DownStream Technologies. In this interview, Joe walks us through how we got into our current situation, with design, fab, and assembly functioning in separate silos, and how DownStream and the IPC-2581 data format can help bridge this gap. He also discusses what we lost by moving from the captive model, and what we stand to gain by knocking down the walls between design and manufacturing.
IPC K-FEST Set to be IPC’s Landmark Event in Korea
06/27/2024 | IPCIPC K-FEST is set to be IPC’s landmark event in Korea on Oct 29, 2024, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.
For Networking, Edge, and IoT Applications: Swissbit Expands PCIe Portfolio
06/27/2024 | SwissbitStorage specialist Swissbit continues to strategically expand its PCIe offerings. The new N2000 (Gen3 PCIe) and N3000 (Gen4 PCIe) product families primarily address applications that require PCIe performance as well as a balanced ratio of low power consumption and reduced heat generation.
IDC Reveals Automotive Semiconductor Market Outlook and Discusses Technological Advancements
06/26/2024 | IDCA recent IDC report, Worldwide Automotive Semiconductor Market Forecast, 2024 categorizes automotive chips into distinct segments: analog chips, logic chips, microprocessors, memory chips, discrete devices, optoelectronic devices, and sensors.
CSPs to Expand into Edge AI, Driving Average NB DRAM Capacity Growth by at Least 7% in 2025
06/26/2024 | TrendForceTrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling.