Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Z-AXIS Will Double Its Surface Mount Capacity
June 21, 2024 | Z-AXISEstimated reading time: 1 minute
Z-AXIS, a fast-growing provider of electronic design and manufacturing services, will double its surface mount technology (SMT) capacity during Phase 1 of a $1.5M USD expansion. The electronics contract manufacturer ordered a total of 15 new pieces of equipment after visiting the IPC APEX 2024 tradeshow this spring.
“This is the first phase of three-phase expansion,” said Michael Allen, Z-AXIS’ President. “Expanding our surface mount capabilities will allow us to take on even more SMT jobs while accelerating production,” he added.
During the first phase of its latest expansion, Z-AXIS will replace its new product introduction (NPI) line with an SMT line that is effectively as fast as its other two high-speed lines combined. The company will retain the current NPI line’s oven but add a board dropper, stencil printer, conveyor, two pick-and-place machines, a board turner, another conveyor, and automated optical inspection (AOI) technology.
Z-AXIS selected the AOI equipment based on information gained at IPC APEX 2024, the electronics manufacturing industry’s largest event in North America. Z-AXIS expanded its wire and cable assembly production in 2020 and has a rich history investing in state-of-the-art equipment. The company’s current expansion is self-funded and reflects a record number of sales bookings this year.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.