-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Schweizer, Zollner Announce Strategic Partnership in the Field of Power Embedding
June 25, 2024 | Schweizer Electronic AGEstimated reading time: 2 minutes

To achieve a CO2-neutral world and an All-Electric Society, where electricity is the primary energy source, innovations like high power densities, reduced losses and system cost advantages are essential. However, the All-Electric Society also requires innovation and collaboration among companies working in these very technology areas to achieve a sustainable transition to energy efficiency. Two traditional companies in the microelectronics ecosystem are now forming a strategic partnership in the field of power embedding. The common goal – a proven increase in efficiency – will be achieved with the p² Pack® embedding technology and its possible applications. This will create added value for the industrial and automotive markets and thus for climate protection and our society.
The power embedding partnership for Schweizer Electronic AG's p² Pack® technology is a design-in collaboration that operates at multiple levels, from design support to system provider. The cooperation will enable a wider range of customers to gain access to power embedding technology. Zollner will provide customers with the support they need to move from traditional designs to embedding design in their products to maximize the technology’s benefits. The partnership will also enable Zollner to integrate the technology directly into its own applications. This partnership is a significant growth opportunity for both companies, fostering the development of new applications and expanding their customer base.
Schweizer Electronic AG's p² Pack® is a power embedding technology that integrates SiC chips directly into printed circuit boards. All applications requiring high power switching can benefit from the advantages of this technology. The most important applications are in the conversion between DC and AC systems. These systems are increasingly confronted with higher power requirements and with expectations for high energy efficiency, maximum reliability and long service life. Schweizer Electronic AG has already been able to demonstrate the superior performance, advantages, and savings that this technology brings to the market in recent years: the patented cutting-edge technology contains both extensive development experience and technological depth, which is already being used in series production by major Tier-1 companies in Europe.
Nicolas-Fabian Schweizer, CEO of Schweizer Electronic AG, is looking forward to the future partnership and collaboration: "Zollner will benefit from our expertise in complex PCB and chip embedding while we will gain from their extensive application knowledge as a leading European EMS service provider. This synergy is a powerful multiplier for both companies and creates the best conditions for innovation! Both family owned, based in Southern Germany and highly specialized, this partnership is a natural fit!” Nicolas Schweizer is the 6th generation to lead the family business of the same name, which is headquartered in Schramberg and has five locations worldwide. SCHWEIZER is one of Europe’s largest suppliers of printed circuit boards and embedding technologies, with a portfolio that includes RF & sensor technology, logic circuits and various technologies for power electronics technologies, including p² Pack.
Ludwig Zollner, CEO of Zollner Elektronik AG, is optimistic about the future collaboration: "We see SCHWEIZER as a partner with whom we can offer our European customers a first-class service. Power embedding is an important topic for the future and we are convinced that we will be able to use the synergy effects resulting from the cooperation to offer our customers added value. We look forward to working together and using the innovative power embedding technology to implement challenging projects!”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.