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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

05/20/2025 | Deca Technologies
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.

Libra Industries Boosts SMT and Electronics Manufacturing Capabilities in Dallas, Texas

05/06/2025 | Libra Industries
Libra Industries is excited to announce the latest upgrades to its surface mount technology (SMT) capabilities at its Dallas, Texas facility.

AT&S Starts High Volume Manufacturing at New Plant in Kulim/Malaysia

05/06/2025 | AT&S
AT&S Austria Technologie & Systemtechnik (Malaysia) Sdn Bhd is ready to start high volume manufacturing at the new campus at Kulim Hi-Tech Park (KHTP) in the state of Kedah. AT&S Malaysia delivers high-end Integrated Circuit (IC) Substrates for AMD’s data center processors and other customers.

DuPont Reports First Quarter 2025 Results

05/02/2025 | PRNewswire
DuPont announced its financial results for the first quarter ended March 31, 2025.

Murata, QuantumScape Start to Explore a Collaboration for Manufacturing of Ceramics

04/24/2025 | Murata
Murata Manufacturing Co., Ltd.  and QuantumScape Corporation have entered into the first phase of an agreement to explore a collaboration for high-volume manufacturing of ceramic film for QuantumScape’s solid-state battery technology.
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