Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Summit Interconnect Acquires Mega Circuit, Expanding RF and Microwave Capabilities

11/09/2026 | Summit Interconnect
Acquisition strengthens Summit’s domestic manufacturing network with dedicated expertise in PTFE-based printed circuit boards for defense and commercial applications.

What It Takes to Test Automotive Power Electronics Assemblies

10/21/2026 | Francesca Pinto, SPEA
Power electronics board assemblies are central to modern vehicle power systems. They include voltage regulators, motor drivers, inverters, DC-DC converters, and onboard chargers, which are found across the range of today's vehicles, from conventional combustion engines to hybrids and full electric vehicles. However, modern power PCBAs do far more than just route and manage electrical energy flow through the vehicle, converting and regulating power for everything from the starter and alternator to the traction motor.

Omega EMS Expands Advanced Inspection Capabilities with New 3D AOI and X-Ray Systems

10/16/2026 | Omega EMS
Investment delivers inline 3D optical inspection across all San Jose SMT production lines and doubles 3D X-ray inspection capacity.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

CACI Wins Contract to Advance CENTCOM Information Advantage and Irregular Warfare Operations

09/28/2026 | CACI International Inc.
CACI International Inc announced that it has received a one-year plus four option periods award to support U.S. Central Command (USCENTCOM) and its mission partners across a demanding and rapidly changing mission environment. The award has a ceiling of $1.5 billion.      
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in