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Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid

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Modern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.

Chungnam National University Researchers Develop Next-Gen Zinc Batteries: Artificial Polymer Nanolayers Improve Zinc Battery Stability

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Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident

02/10/2025 | Zhen Ding Technology
Zhen Ding Technology Holding Co., Ltd. (Ticker: 4958) announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory  (January 5). BoardTek promptly evacuated all personnel without any injuries. After firefighters arrived and handled the situation, the fire was extinguished, and follow-up measures were taken safely.

Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident

01/06/2025 | Zhen Ding Technology
Zhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory (January 5th). BoardTek promptly evacuated all personnel without any injuries.Zhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory.

Are Our Stackup Rules No Longer Valid?

12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+
Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
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