The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Scanfil to Exhibit at Electronica 2024
July 5, 2024 | ScanfilEstimated reading time: Less than a minute
Electronica 2024 is set to be a significant event in the electronics industry, scheduled for November 12-15 in Munich. It’s recognized as the world’s leading trade fair and conference for electronics, offering a comprehensive platform for international exhibitors to showcase innovations and trends.
The fair will cover the entire spectrum of modern electronics, including high-performance systems and components from semiconductor and microsystems technology, measurement and sensor technology, display technology, and vehicle electronics. It’s an essential driver for the increasing networking of communication, knowledge, machines, and infrastructures. For professionals aiming to keep pace with the rapid evolution of electronics, Electronica 2024 represents an invaluable opportunity for engagement and insight.
Team Scanfil will be there to present cutting-edge electronic manufacturing services and solutions. Engage with our experts to discuss about specific needs and challenges, and explore how our services can be tailored to meet your requirements. Meet our team and learn about the latest trends and how we are addressing them with our services and solutions. Let’s meet at our booth 435 in hall A1!
Share on:
Suggested Items
Diverging Electrification Goals between Honda and Nissan; Accelerated Resource Integration will be the Top Priority Post-Merger
12/25/2024 | TrendForceHonda and Nissan—two of Japan’s largest automakers—announced on December 23rd, 2024, that they have entered into merger negotiations, with plans to finalize an agreement by June 2025. Mitsubishi Motors is also expected to join the partnership.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
The 500 Largest Cellular IoT Deployments Together Account for 632 Million Units
12/23/2024 | Berg InsightBerg Insight presents its yearly updated database covering the 500 largest cellular IoT deployments identified as part of the company’s world-class IoT market research activities since 2004.