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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available

10/29/2025 | I-Connect007
I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.

ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at productronica

10/21/2025 | ITW
ITW EAE will be showcasing its latest developments at productronica, November 18-21 in Munich, Germany. The ITW EAE booth A4–554 will have MPM, Camalot, Electrovert, Vitronics Soltec and Despatch applications experts on hand as well as sales and management to answer questions and offer solutions.

New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection

10/22/2025 | I-Connect007
In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.

Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication

10/15/2025 | I-Connect007
I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.

I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series

10/10/2025 | I-Connect007
In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
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