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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
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IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations
July 8, 2024 | IPCEstimated reading time: Less than a minute
The IPC workshop on IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations to be held August 23, 2024 | 1:00 - 5:00pm CST, will be organized during 2024 Taiwan Robot and Intelligent Automation Exhibition \ 2024 Taipei International Industrial Automation Exhibition from August 21-24, showcasing the research and experience on industry pain points:
- Introduction of IPC-HERMES-9852 & Basic Architecture & Transmission Mechanism & Interchangeable Messages
- Introduction of IPC-2951-CFX & Basic Architecture & Transmission Mechanism & Basic Specifications (Table 6-1, 6-2) & Interchangeable Messages & Application Scene Introduction & Factory of the Future Applications & Real Scene Demonstrations
- AMR Automated Loading and Unloading (CFX)
- First Station Data & Batch Completion Data & Rework Station PCB Placement & Command Stop Board
- Integration System Manufacturer – Enlight Technology for CFX Equipment Integration
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Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
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Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications
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