-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Altair Named Samsung Advanced Foundry Ecosystem Partner
July 9, 2024 | AltairEstimated reading time: 1 minute
Altair a global leader in computational intelligence, has been selected as an electronic design automation (EDA) partner for the Samsung Advanced Foundry Ecosystem (SAFE™).
Through this collaboration, Altair and Samsung Electronics will combine Altair's comprehensive EDA technology with Samsung Foundry's manufacturing capabilities to establish a more innovative, more efficient semiconductor design and production process.
“Integrated design and verification solutions are a key element in the semiconductor industry, which demands fast, high-quality production,” said Doha Kim, country manager, Altair Korea. “By providing various design and verification solutions, Altair supports collaboration within the ecosystem, including with Samsung Foundry, design houses, and fabless companies, to enhance productivity and quality.”
Altair was selected as a SAFE EDA partner for its diverse technological capabilities in providing various solutions needed for semiconductor design and verification, including silicon debugging tools. These solutions are used to meet and verify various design requirements for foundry customers by providing chip design, analog circuit verification, production process simulation, and rapid debugging technology.
Among these solutions is Altair® FlowTracer™, a visualization platform for digital circuit design flow that facilitates problem identification and resolution for library and process design kit (PDK) users through visualization. Additionally, it standardizes complex multi-structure design flows, enabling efficient management of semiconductor design and verification processes.
Within the partnership, Altair also plans to offer integrated solutions including high-performance computing (HPC) resource management, AI-based meta-scheduling technology, and data analytics solutions. Together, both companies aim to enhance market responsiveness and product development competitiveness to quickly handle large amounts of data.
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.