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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Camtek Receives a $20M Order from a Tier-1 OSAT
July 10, 2024 | CamtekEstimated reading time: Less than a minute
Camtek Ltd., announced that it has received a new multiple-systems’ order for a total of $20 million from a tier-1 Outsourced Semiconductor Assembly & Test (OSAT), for the inspection and metrology of Advanced Packaging applications. The systems are expected to be delivered in the second half of 2024.
Rafi Amit, CEO of Camtek commented, “This significant order from a tier-1 OSAT underscores our leadership in providing inspection and metrology tools for various Advanced Packaging applications.
This order, together with continuous business momentum including orders we recently received for Chiplets and HBM applications, supports our expectations for continued growth in the second half of 2024.”
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