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SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
July 10, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.
Why Attend?
- Deep Dive into High Reliability: Gain an in-depth understanding of cutting-edge practices in design, manufacturing, testing, and assembly for extreme environments.
- Expert Insights: Learn from industry leaders who are at the forefront of High Reliability technology.
- Future of Manufacturing: Discover how High Reliability technology is shaping the future of customer projects and pushing the boundaries of manufacturing.
- Networking Opportunities: Connect with fellow professionals, exchange ideas, and expand your professional network.
Speakers:
- Shantanu Joshi, KOKI Solder: Improving Reliability Soldering Materials
- Vladimir Sitko, PBT works: Cleaning Process Controls and Maintenance
- Sean Torres, JBC Tools USA: Critical Importance of Control during the Hand Solder Process
- Bill Capen, Honeywell: The Value of Having a Mentor in SMT Manufacturing
Cost:
- Members/Students: FREE!
- Non-Members: $30 USD
Don't miss this opportunity to enhance your knowledge and connect with industry experts. Register now and secure your spot for this must-attend virtual event.
To register, visit https://smta.org/events/EventDetails.aspx?id=1860016&group=225188.
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SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.