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SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
July 10, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.
Why Attend?
- Deep Dive into High Reliability: Gain an in-depth understanding of cutting-edge practices in design, manufacturing, testing, and assembly for extreme environments.
- Expert Insights: Learn from industry leaders who are at the forefront of High Reliability technology.
- Future of Manufacturing: Discover how High Reliability technology is shaping the future of customer projects and pushing the boundaries of manufacturing.
- Networking Opportunities: Connect with fellow professionals, exchange ideas, and expand your professional network.
Speakers:
- Shantanu Joshi, KOKI Solder: Improving Reliability Soldering Materials
- Vladimir Sitko, PBT works: Cleaning Process Controls and Maintenance
- Sean Torres, JBC Tools USA: Critical Importance of Control during the Hand Solder Process
- Bill Capen, Honeywell: The Value of Having a Mentor in SMT Manufacturing
Cost:
- Members/Students: FREE!
- Non-Members: $30 USD
Don't miss this opportunity to enhance your knowledge and connect with industry experts. Register now and secure your spot for this must-attend virtual event.
To register, visit https://smta.org/events/EventDetails.aspx?id=1860016&group=225188.
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.