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SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
July 10, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.
Why Attend?
- Deep Dive into High Reliability: Gain an in-depth understanding of cutting-edge practices in design, manufacturing, testing, and assembly for extreme environments.
- Expert Insights: Learn from industry leaders who are at the forefront of High Reliability technology.
- Future of Manufacturing: Discover how High Reliability technology is shaping the future of customer projects and pushing the boundaries of manufacturing.
- Networking Opportunities: Connect with fellow professionals, exchange ideas, and expand your professional network.
Speakers:
- Shantanu Joshi, KOKI Solder: Improving Reliability Soldering Materials
- Vladimir Sitko, PBT works: Cleaning Process Controls and Maintenance
- Sean Torres, JBC Tools USA: Critical Importance of Control during the Hand Solder Process
- Bill Capen, Honeywell: The Value of Having a Mentor in SMT Manufacturing
Cost:
- Members/Students: FREE!
- Non-Members: $30 USD
Don't miss this opportunity to enhance your knowledge and connect with industry experts. Register now and secure your spot for this must-attend virtual event.
To register, visit https://smta.org/events/EventDetails.aspx?id=1860016&group=225188.
Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.