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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
July 10, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.
Why Attend?
- Deep Dive into High Reliability: Gain an in-depth understanding of cutting-edge practices in design, manufacturing, testing, and assembly for extreme environments.
- Expert Insights: Learn from industry leaders who are at the forefront of High Reliability technology.
- Future of Manufacturing: Discover how High Reliability technology is shaping the future of customer projects and pushing the boundaries of manufacturing.
- Networking Opportunities: Connect with fellow professionals, exchange ideas, and expand your professional network.
Speakers:
- Shantanu Joshi, KOKI Solder: Improving Reliability Soldering Materials
- Vladimir Sitko, PBT works: Cleaning Process Controls and Maintenance
- Sean Torres, JBC Tools USA: Critical Importance of Control during the Hand Solder Process
- Bill Capen, Honeywell: The Value of Having a Mentor in SMT Manufacturing
Cost:
- Members/Students: FREE!
- Non-Members: $30 USD
Don't miss this opportunity to enhance your knowledge and connect with industry experts. Register now and secure your spot for this must-attend virtual event.
To register, visit https://smta.org/events/EventDetails.aspx?id=1860016&group=225188.
Suggested Items
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
IDENTCO to Showcase Specialized Labels and Presenters for Electronics Component Production at IPC APEX
02/26/2025 | IDENTCOIDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will showcase its robust range of solutions for printed circuit boards (PCBs) and electronic components at IPC APEX Expo.
The Knowledge Base: Challenges and Considerations of Harsh Environments
02/26/2025 | Mike Konrad -- Column: The Knowledge BaseIn today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design.