The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
July 10, 2024 | SMTAEstimated reading time: 1 minute
The SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.
Why Attend?
- Deep Dive into High Reliability: Gain an in-depth understanding of cutting-edge practices in design, manufacturing, testing, and assembly for extreme environments.
- Expert Insights: Learn from industry leaders who are at the forefront of High Reliability technology.
- Future of Manufacturing: Discover how High Reliability technology is shaping the future of customer projects and pushing the boundaries of manufacturing.
- Networking Opportunities: Connect with fellow professionals, exchange ideas, and expand your professional network.
Speakers:
- Shantanu Joshi, KOKI Solder: Improving Reliability Soldering Materials
- Vladimir Sitko, PBT works: Cleaning Process Controls and Maintenance
- Sean Torres, JBC Tools USA: Critical Importance of Control during the Hand Solder Process
- Bill Capen, Honeywell: The Value of Having a Mentor in SMT Manufacturing
Cost:
- Members/Students: FREE!
- Non-Members: $30 USD
Don't miss this opportunity to enhance your knowledge and connect with industry experts. Register now and secure your spot for this must-attend virtual event.
To register, visit https://smta.org/events/EventDetails.aspx?id=1860016&group=225188.
Share on:
Suggested Items
The Effects of Copper on a Transmission Line
12/23/2024 | Todd Kolmodin, Gardien ServicesAs technology advances, our substrates become increasingly smaller, and chip technology has progressed to where HDI and UHDI are household terms. Ten years ago, this new design architecture would strike fear in the hearts of any plating engineer. Unfortunately, North American and European manufacturing has lagged due to excessive offshoring of commercial and some high-reliability product lines. Fortunately, most of the military and aerospace product has remained controlled. But in doing so, the designs utilized by the mil/aero and medical sectors’ reliability lines were corralled into the manufacturing capabilities of the North American and European providers.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
The Knowledge Base: The Era of Advanced Packaging
12/23/2024 | Mike Konrad -- Column: The Knowledge BaseThe semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.
HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor
12/03/2024 | HyRelHyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
11/19/2024 | Gen3GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in