Bridging the Pacific: Why Global Manufacturing Is No Longer Optional
Knocking Down the Bone Pile: Minimizing X-ray Dosage During PCB Inspection
Global Sourcing Spotlight: Finding Your Greatest Sourcing Asset in Partnerships
Today marks the official launch of Moore4Power (More than Moore for Disruptive Innovations in Power Electronics), one of Europe's most ambitious semiconductor R&D projects. Led by Infineon Technologies AG, a global leader in power semiconductors, this Chips Joint Undertaking initiative unites large entities, small and medium-sized enterprises and research institutes from 15 European countries to develop the next generation of smart, efficient and sustainable power electronics. With a total project volume of €91 million, Moore4Power will run for three years aiming to deliver breakthrough innovations that strengthen Europe's technological sovereignty and sustainability in the field of power electronics.
For decades, progress in electronics followed Moore’s Law: smaller transistors, delivering higher performance at lower cost. Today, traditional scaling is reaching physical and economic limits. Moore4Power addresses this challenge by shifting the focus from individual components to system-level innovation. Combining technologies, materials, and functions in smarter, application-driven ways, the initiative unlocks major gains in efficiency, reliability and power density.
“Power electronics are a decisive enabler for energy efficiency and sustainability. With Moore4Power, we are setting the next level of smart integration to achieve significantly higher energy and resource efficiency,” says Jochen Koszescha, Coordination Lead for the Moore4Power project at Infineon Technologies AG. “We are proud to join forces with an outstanding consortium from academia, research and industry to make a decisive contribution to Europe’s Clean Industrial Deal.”
Smarter integration beyond traditional scaling
At the core of Moore4Power is heterogeneous integration, which combines different semiconductor technologies such as silicon (Si), silicon carbide (SiC) and gallium nitride (GaN), together with sensing, control and communication functions to form tightly integrated systems. Each technology is used exactly where it performs best, enabling higher efficiency, improved reliability and more compact designs. Power chiplet technology enables scalable architectures and more flexible product variants at globally competitive cost levels. This modular approach will pave the way for next-generation solutions in a wide range of highly relevant applications. The foundation was laid in the predecessor project PowerizeD, a large Chips JU-funded project completed in 2025, which delivered outstanding advances in efficiency and reliability.
More performance for energy, mobility and industry
Moore4Power focuses on high‑impact sectors where power conversion drives cost, CO₂ reduction and reliability. In wind energy, advanced power electronics can operate at the core of turbines to improve energy conversion and increase harvested power; in e‑mobility, advanced power electronics will enable up to 99 percent efficiency with near‑loss‑free, bidirectional charging; and in railway systems, they will cut propulsion losses by at least 30 percent, significantly boosting energy efficiency.
Faster development through digital intelligence
Moore4Power not only innovates the product, it also reinvents the development process itself. AI‑assisted models, digital twins and automated workflows will be used to radically shorten development cycles. Hardware and software will be designed in parallel to reduce simulation time while increasing accuracy. As a result, the time from first fab samples to a validated datasheet release can be reduced to just one week, compared to several weeks today. This acceleration lowers costs, speeds up industrialization and strengthens Europe’s industrial competitiveness. First scalable demonstrators will be tested under real-word conditions.
Sustainability built in from the start
One central achievement is the Digital Product Passport (DPP), embedded directly into power modules via wireless access. The DPP will provide lifecycle data such as operating conditions, state of health and remaining lifetime throughout the product’s use. This transparency will enable smarter maintenance, longer product lifetimes, better reuse and reduced raw‑material consumption – delivering substantial CO₂ savings and a concrete contribution to Europe’s circular economy and climate goals.
