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Continuous Improvement Veteran Florin Larion Joins Intervala as Director of Operational Excellence
July 11, 2024 | IntervalaEstimated reading time: 1 minute

Intervala LLC, a premier full-service electronics manufacturing services provider, announced that Florin Larion, an accomplished lean and continuous improvement leader, has been named corporate director of operational excellence. In this role, Florin is responsible for advancing a culture of continuous improvement throughout Intervala’s business and using Lean methodologies and tools to achieve companywide process-related improvements and strategic objectives.
Florin joined Intervala from AR RF/Microwave Instrumentation, bringing nearly 20 years of Lean practitioner experience within the global manufacturing arena. He previously held continuous improvement management roles and led Lean initiatives for Knoll Inc., Sterlite Technologies Ltd., NCR Corporation, Flextronics International Ltd., Corning Cable Systems, and Danaher Corporation, among other U.S.-based and global manufacturers. Florin holds a master’s degree in mechanical engineering from the Polytechnic Institute of Cluj and is a Lean Six Sigma master black belt, certified DMAIC Six Sigma black belt and recognized kaizen sensei.
“Our unrelenting commitment to operational excellence is a key element of Intervala’s culture and promise to always provide our customers with the smartest solutions to achieve their organizational goals,” said Teresa Huber, president and CEO. “We are excited to welcome another high-caliber professional such as Florin to the Intervala team and look forward to him applying his extensive lean and continuous improvement expertise to further facilitate companywide process-related improvements and strategic objectives for the benefit of our customers.”
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Brent Fischthal - Koh YoungSuggested Items
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
10/01/2025 | John Watson -- Column: Elementary, Mr. WatsonFor the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud pits that drag a signal down like attenuation. The takeaway was clear that a PCB is not a flat drawing; it's an electromagnetic ecosystem filled with hazards that test every signal that dares to cross it. The real danger lies not in the obstacles themselves, but in the fact that many designers never see them.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/26/2025 | Marcy LaRont, I-Connect007Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.
KYZEN to Provide Solutions to Drive Reliability at the Battery Show
09/26/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The Battery Show North America from Oct. 6-9 at Huntington Place in Detroit, MI.
How PCBA Excellence Transforms High-mix Operations
09/22/2025 | Chintan Sanghani, Electronics Center for ExcellenceWith over 30 years of manufacturing excellence, our organization has built deep expertise in PCBA contract manufacturing for downhole oilfield tools. Through years of focused operational leadership in this demanding sector, we've learned that in high-mix, low-volume (HMLV) environments, traditional manufacturing approaches can create more bottlenecks than breakthroughs.