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EV Group’s EVG 880 LayerRelease System Wins 2024 Best of West Award
July 15, 2024 | SEMIEstimated reading time: 1 minute
The EVG®880 LayerRelease™ system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced at SEMICON West 2024 at the Moscone Center in San Francisco. Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The EVG®880 LayerRelease™ system is the first high volume manufacturing (HVM) equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps.
“The EVG 880 LayerRelease system enables an important step forward for 3D integration,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. By enabling 3D stacking of ultra-thin layers, the EVG880 LayerRelease system allows for shorter distances between stacked dies, which in turn allows faster data exchange from one die to another while reducing power consumption. “Congratulations to EV Group for again winning the Best of West competition.” The company previously won for its LITHOSCALE Maskless Exposure System in 2021.
EV GroupEV Group is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
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OSI Systems Reports Fiscal Q1 2026 Financial Results
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Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
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David Schild Addresses Printed Circuit Board Issues as a Panelist at AUVSI
10/30/2025 | PCBAAOn October 28, Printed Circuit Board Association of America executive director David Schild appeared on a panel at the Association for Uncrewed Vehicle Systems International (AUVSI) conference on the topic of “First Supply Chains: Strengthening the Industrial Base for Autonomy.” PCBAA sponsored the event and Schild shared his views on issues facing the American microelectronics industry.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.