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Designers Notebook: Power and Ground Distribution Basics

10/29/2025 | Vern Solberg -- Column: Designer's Notebook
The principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.

Standex Electronics Unveils New Brand Identity to Power the Next Era of Engineering Innovation

10/23/2025 | PRNewswire
Standex Electronics, a business segment of Standex International Corporation and a global leader in precision-engineered electronic components, has unveiled a refreshed brand identity that represents the next evolution of its engineering excellence.

PCBA Market Poised to Reach $147.5 Billion by 2035

10/20/2025 | Globe Newswire
Global printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035

Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions

10/14/2025 | Wurth Elektronik
Würth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i

Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing

10/14/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
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