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Advanced Packaging-to-Board-Level Integration: Needs and Challenges

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Advanced Packaging: Preparation is Now

09/15/2025 | Nolan Johnson, I-Connect007
In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
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