-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
An Interview With My Mentor, Christina Rutherford
July 17, 2024 | Hannah GraceEstimated reading time: 1 minute

I first came to IPC APEX EXPO as a Student Board Member, and during my time on the board, I discovered that the show is not just another endpoint to a conference, but a launching pad for ideas, connections, and inspiration that lasts for decades. As participants leave the conference, they continue sharing knowledge and experiences that linger, affirming the enduring significance of IPC APEX EXPO in shaping the future of electronics.
While preparing for this year’s show, I had the privilege of interviewing Honeywell engineer Christina Rutherford. Not only is she chair of some IPC standards committees, but she’s also my mentor as an early-career emerging engineer. Join me in uncovering the insights and enthusiasm that drive her to participate in this industry-leading event year after year.
Christina, thank you for joining me today. To kick things off, tell me about your current role at Honeywell and how you knew you wanted to enter the electronics industry.
Christina Rutherford: I’m an advanced hardware engineer in materials engineering, focusing on manufacturing cables and hardware design. Originally, I didn’t know I wanted to enter the electronics industry. Seven years ago, and with a degree in chemistry, a friend encouraged me to apply for a job in material and process engineering at an electronics site within Honeywell.
To read the rest of this article in the Summer 2024 issue of IPC Community, click here.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.