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Innovation rippled across the entire electronics supply chain in 2025, from semiconductor packaging and substrate materials to denser boards and more robust designs. This issue explores these defining moments and what we can expect in the year to come.
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Taiwanese Association of Companies Visits IMI
July 17, 2024 | IMIEstimated reading time: Less than a minute
The Philippine Trade & Investment Center (PTIC) in Taipei along with 27 delegates from the Taiwanese Association of companies -- Chung-Hua Institution for Economic Research (CIER), Taiwan Smart Electric Bicycle, Association (TSEBA), and Commercial Vehicle Technology Development Association (CVTDA) visited IMI Philippines last July 10, 2024.
During the tour, the delegation was brought to the electric motorcycle manufacturing facility, the electronics assembly lines, the test systems and development line, and the Analytical Testing and Calibration Laboratory.
In search of promising trade and investment leads in the country, the visiting entrepreneurs led by Anthony Rivera, director for commercial affairs of PTIC, came to explore potential business collaborations in the Philippines. IMI is one of those being considered.
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Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging
01/14/2026 | I-Connect007The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.
Hall of Fame Spotlight Series: Highlighting Michael Carano
01/14/2026 | Dan Feinberg, I-Connect007This month’s Hall of Fame spotlight features Michael Carano, a former recipient of the Finnegan Standards Medal, which honors those who have exhibited extraordinary leadership in developing and applying voluntary standards. He is the recipient of the Association’s Dieter Bergman Fellowship Award and was inducted into the Hall of Fame in 2014. Still well known within the industry, many of us have had the pleasure of working with Mike on numerous Association projects and committees over the years.
Global Electronics Association and Altium Launch First Joint PCB Design Certifications
01/07/2026 | Global Electronics AssociationThe Global Electronics Association, the leading voice for the electronics industry, has partnered with Altium LLC, a global leader in electronics design software and solutions, to launch two new industry-recognized certification programs for printed circuit board (PCB) design: Altium Designer Associate Certification and Altium Designer Expert Certification.
IPC Hand Soldering Competition 2026 UK Regional Qualification Opens Registration
01/05/2026 | Global Electronics AssociationThe IPC Hand Soldering Competition (HSC) 2026 UK Regional Qualification will take place from 3–5 February 2026 at the Farnborough International Exhibition Centre, bringing together top electronics manufacturing professionals to showcase their precision soldering skills.
Pan-European Electronics Design Conference Returns to Prague in January
12/31/2025 | Global Electronics AssociationThe Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.