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Don’t Just Survive, Thrive: The July 2024 Issue, PCB007 Magazine
July 18, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
With technology expected to advance at an even greater exponential pace over the next 20 years, our industry must step up to the need for commensurate development, reinvention, modification, evolution, and expansion. If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive.
What does it take to remain viable and grow and prosper during so much change? It takes resilience, which includes commitment, vision, positivity, and a willingness to adapt. Resilience is key to thriving over the long term—from the individual to a company, industry, and nation.
In this issue of PCB007 Magazine, our contributors explore these concepts meant to help you take your business to the next level.
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Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
01/19/2026 | Edy Yu, Editor-in-Chief, ECIOThe Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1
01/19/2026 | Vern Solberg -- Column: Designer's NotebookThe development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.
Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
01/19/2026 | Devan Iyer and Matt Kelly, Global Electronics AssociationIn November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.
Where Electronics Manufacturing Turns for Trusted Technical Insight
01/12/2026 | I-Connect007 Editorial TeamIn an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.
Confronting an Era of Transformation in Europe
01/13/2026 | Marcy LaRont, I-Connect007If 2024 and 2025 felt turbulent inside your factory walls, the data now confirms it: Europe’s electronics manufacturing sector has entered a period of significant transition. At productronica, the Global Electronics Association’s industry intelligence team presented an overview of the European EMS industry, and what emerged was more than a portrait of a market cycling down.