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Two Additional Boeing O3b mPOWER Satellites Successfully Communicating in Space

12/23/2024 | Boeing
Two more Boeing-built O3b mPOWER satellites are sending and receiving signals in space after launching from the Kennedy Space Center, Florida at 5:26 p.m.

The Knowledge Base: The Era of Advanced Packaging

12/23/2024 | Mike Konrad -- Column: The Knowledge Base
The semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.

GB200 Rack Supply Chain Requires Further Optimization, Peak Shipments Expected Between 2Q25 and 3Q25

12/18/2024 | TrendForce
As the market closely follows the progress of NVIDIA’s GB200 rack-mounted solution, TrendForce’s latest research indicates that the supply chain requires additional time for optimization and adjustment.

ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

12/13/2024 | ROHM
ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea.

onsemi Acquires Silicon Carbide JFET Technology to Enhance Its Power Portfolio for AI Data Centers

12/13/2024 | onsemi
onsemi announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
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