Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
July 19, 2024 | AlltematedEstimated reading time: 1 minute
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Softened bottom-side solder joints can be insufficient for retaining parts. Dispensed bonding done before second side reflow requires additional equipment or secondary processes. Packaged in tape and reel, the underfilm gets picked and placed along with the other components prior to reflow. PLACE-N-BOND™ reels are mounted on SMT feeders, and implementation was easily accomplished without dispensers or secondary processes.
Responding to the growing demand for PLACE-N-BOND™ in component retention, Alltemated Inc. invested in new in-house testing capabilities to support application development. With the addition of a reflow oven, Alltemated simulates an application’s double-sided reflow to validate retention prior to recommending the correct underfilm material, size, and thickness.
PLACE-N-BOND™ continues to be utilized in numerous devices worldwide. This innovative solution not only helps components hold on during second reflow but also adds solder joint strain relief and mechanical strength to the component after assembly. Originally developed for BGA solder ball/joint reliability, the number of applications utilizing underfilm in double-sided reflow part retention has increased 4X over the past year.
For more information on double-sided reflow retention and solder joint reliability of printed circuit assemblies visit the Alltemated website.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Altus Group Introduces the ASSCON VP 2200 for High-Performance PCB Assembly
09/10/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, is now offering the ASSCON VP 2200 vapour phase reflow system, the first dual-lane inline VP unit available in the region.
Pick and Place Machine Innovator - NECTEC Launches Next-Gen SMT Line Solution With LED and X-ray Technology
08/26/2025 | Globe NewswireNECTEC PTE. LTD., a leading provider of SMT electronics manufacturing equipment, announced the official launch of its next-generation SMT solutions, featuring newly upgraded pick and place machine, specialized LED pick and place machines, enhanced Reflow Oven technology, advanced X-ray Inspection, high-speed X-ray Counter, and premium Solder Paste
BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.