The Shaughnessy Report: The Designer of Tomorrow
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
July 19, 2024 | AlltematedEstimated reading time: 1 minute
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Softened bottom-side solder joints can be insufficient for retaining parts. Dispensed bonding done before second side reflow requires additional equipment or secondary processes. Packaged in tape and reel, the underfilm gets picked and placed along with the other components prior to reflow. PLACE-N-BOND™ reels are mounted on SMT feeders, and implementation was easily accomplished without dispensers or secondary processes.
Responding to the growing demand for PLACE-N-BOND™ in component retention, Alltemated Inc. invested in new in-house testing capabilities to support application development. With the addition of a reflow oven, Alltemated simulates an application’s double-sided reflow to validate retention prior to recommending the correct underfilm material, size, and thickness.
PLACE-N-BOND™ continues to be utilized in numerous devices worldwide. This innovative solution not only helps components hold on during second reflow but also adds solder joint strain relief and mechanical strength to the component after assembly. Originally developed for BGA solder ball/joint reliability, the number of applications utilizing underfilm in double-sided reflow part retention has increased 4X over the past year.
For more information on double-sided reflow retention and solder joint reliability of printed circuit assemblies visit the Alltemated website.
Share on:
Suggested Items
Indium to Showcase Power Electronics Products at NEPCON Japan
01/14/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
Altus Highlights Heller Industries Advances in Void Reduction Under 1%
01/06/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.