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Innovative and Cost-effective BGA Re-balling
July 23, 2024 | Shavi Spinzi, Nano Dimension/EssemtecEstimated reading time: Less than a minute
A new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
In this article, we explore the challenges, solutions, and impact on assembly with large BGA devices and propose a new technique appropriate for many electronics segments, including military, aerospace, computing, and communication.
The Need for BGA Re-balling
There are several reasons for BGA re-balling, including economic, technological, reliability, sustainability, and specific industry requirements.
To read this entire article, which appeared in the July 2024 issue of SMT007 Magazine, click here.
Suggested Items
Cost-optimize Your PCB Design and Specifications
08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupKnowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers
06/26/2024 | BUSINESS WIREEstablished in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass-producer of PCBs (Printed Circuit Boards), thus contributing significantly to the advancement of the nation's electronics sector for over six decades.
SMTA Oregon Event Spreads Its Wings
06/25/2024 | Nolan Johnson, I-Connect007Hillsboro, Oregon is home to the largest Intel campus in the United States as the base of operations for most of Intel’s CPU development. Hillsboro boasts experts and teams in IC and PCB physical layout, packaging, and R&D. Intel and satellite companies in its orbit deliver PCB fabrication and PCB assembly as well. So it's no surprise that SMTA Oregon’s annual meeting takes place practically in the shadows of Intel’s Hillsboro campus.