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BGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
The new X-ray system enables BGA Technology to perform high-resolution, non-destructive inspection of complex electronic assemblies, including BGAs, QFNs, and other hidden solder joints critical to high-reliability applications. The investment strengthens the company’s ability to detect defects such as voiding, insufficient solder, and misalignment—issues that are not visible through traditional inspection methods.
“We continue to invest in the tools and technology needed to support our customers at the highest level,” said Jayanth Kygonhalli, CTO, BGA Technology. “The addition of this Creative Electron system allows us to deliver faster, more accurate analysis and further reinforces our commitment to quality and reliability.”
The TruView™ Simplex system provides intuitive operation, advanced imaging capabilities, and rapid analysis, enabling BGA Technology’s engineering team to efficiently support failure analysis, process validation, and quality assurance requirements across a range of industries.
As demand grows for high-reliability electronics in aerospace, defense, and other critical sectors, advanced inspection solutions like X-ray are becoming essential. With this addition, BGA Technology is well-positioned to meet increasing customer requirements for precision, traceability, and process control.
