Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
TRI Brings High-Speed Line Inspection at the SMTA Guadalajara 2024
July 24, 2024 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join the SMTA Guadalajara Expo 2024 to showcase our award-winning Inspection solutions for the SMT industry. Visit booth #1018 at the SMTA Expo Guadalajara from September 11 to 12, 2024, to experience the latest test and inspection innovations for the Electronics Manufacturing Industry.
TRI will showcase the High-Speed Line 3D AOI, TR7700QH SII, able to inspect at speeds of up to 80 cm²/sec, featuring a 21 MP camera with 15 μm resolution, achieving a 40% speed improvement over its predecessor. For instance, it inspects a dense 336 x 208 mm board in 9 seconds and a 577 x 360 mm telecom server board in 66 seconds.
The TR7700QH SII's high inspection speed increases throughput and reduces inspection time, lowering overall costs. This is especially beneficial in high-volume production, where small cost reductions lead to significant savings. Its ease of programming and AI solutions reduce operational costs and downtime by minimizing training efforts and required expertise.
In addition to the TR7700QH SII, TRI will also present our award-winning 3D Solder Paste Inspection (SPI) solution, the TR7007QI Plus. TRI will also showcase the High-Pin-Count In-Circuit Test (ICT) solution, TR8100LLV, and a live demonstration of our cutting-edge Automated 3D X-Ray Inspection (AXI) system.
Discover why leading Electronics Manufacturing Services (EMS) companies rely on TRI as their test and inspection partner. Visit us at SMTA Guadalajara 2024, booth #1018, for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
Celebrating 35 years of Growing Together
Join us in celebrating 35 years of Growth Together! Throughout the year, TRI will showcase AI-powered Test and Inspection solutions at exhibitions and seminars. Our sustained success reflects a commitment to excellence and a journey of continuous Growth with our valued customers.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.