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SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair

06/12/2025 | SEMI
SEMI, the industry association representing the global electronics design and manufacturing supply chain, today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association's by-laws.

StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336

06/12/2025 | StratEdge
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336.

Micron, Trump Administration Announce Expanded U.S. Investments in Leading-Edge DRAM Manufacturing and R&D

06/12/2025 | Micron
Micron Technology, Inc. and the Trump Administration today announced Micron’s plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs.

'TSMC-UTokyo Lab' Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation

06/12/2025 | TSMC
The University of Tokyo (UTokyo) and TSMC announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
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