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Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance

09/02/2026 | Cadence Design Systems
Cadence announced that its PHY and controller IP for the PCI Express® (PCIe®) 6.0 specification, implemented in the TSMC N3 process, achieved first-pass success at the recent PCI-SIG® compliance workshop held in late July.

SMTA Introduces New Academic Institution Membership

08/21/2026 | SMTA
The SMTA is introducing a new Academic Institution Membership designed to strengthen connections between academic institutions and the electronics manufacturing industry while helping prepare the next generation of industry professionals.

Zhen Ding, NTHU Showcase Smart Manufacturing R&D at IEEE Conference

08/17/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global PCB industry leader, and National Tsing Hua University (NTHU) have achieved significant results through their industry-academia collaboration, with five smart manufacturing research papers selected for presentation at the 22nd IEEE International Conference on Automation Science and Engineering (IEEE CASE 2026), held August 17-21 in Shenyang, China.

4D_Additive Software Introduces New Industrial 3D Printing Workflow

08/16/2026 | CoreTechnologie
CoreTechnologie optimizes its 4D_Additive 3D printing software with a new Build History, automated data preparation, and enhanced functions for SLM supports and lattice structures.

IMAPS Enhances IMAPS Academy

08/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS), the leading organization dedicated to advancing microelectronics and electronics packaging, is pleased to announce the updated IMAPS Academy—an enhanced online training platform designed to address the industry's growing workforce development needs.
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