The Right Approach: Get Ready for ISO 9001 Version 6
Dan’s Biz Bookshelf: ‘Still Broke: Walmart’s Remarkable Transformation'
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
Technology Adoption and the Role of Automation
July 30, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute
In a recent paper at the SMTA Pan Pacific Strategic Electronics Symposium 2024, Auburn University professors highlighted their findings from their 2023 “Smart Manufacturing Adoption Study” Technical Report 23-01. The paper emphasizes five points that are important for the adoption of advanced technologies:
- Small- and medium-sized manufacturers (SMMs) face significant barriers to adopting Industry 4.0 technologies, such as AI, due to a lack of awareness, proven business cases, and a skilled workforce.
- The leading challenges for manufacturers in adopting smart technologies are having an operations workforce, operational efficiency, and the presence of an engineering workforce.
- Forty percent of manufacturers rank automation as their No. 1 technology solution, followed by 3D printing, sensors/IoT, and predictive analytics. AI is also gaining interest as a top technology solution.
- AI and ML have various application areas in electronics manufacturing, including equipment reliability, quality improvement, cost reduction, demand forecasting, inventory optimization, and overall process efficiency.
- The implementation of AI in electronics manufacturing is still in its early stages, with only 30% of companies believing they are generating value through AI applications.
To read this entire conversation, which appeared in the July 2024 issue of PCB007 Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in