-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Sondrel’s SFA 100 is ideal for AI at the Edge
July 31, 2024 | SondrelEstimated reading time: 2 minutes

Sondrel (AIM: SND), a leading provider of ultra-complex custom chips for leading global technology brands, has optimised its SFA 100 to make it ideal for battery-powered, AI at the Edge applications. The SFA 100 is one of the five architectural platforms in the company’s Architecting the Future chip design platform which provides a ready-made design baseline that the company uses to build a bespoke solution for every customer much faster than starting from scratch each time.
“The drive to AI everywhere was clear at this year’s CES,” said John Chubb, Sondrel’s CEO. “It enables companies to create better, more feature-rich products but augmenting with AI is not a simple task. It requires much more powerful processor cores than a standard version of a device to handle the large amounts of data involved which can’t just be added onto an existing design. It requires a design from scratch to make sure that the right processors, memory, DSPs, NoC and other components all fit together against the target Power, Performance, Area and Timing specifications.
“This is where our Architecting the Future approach can save a significant amount of time and engineering effort. We don’t start from scratch every time as we use existing, proven blocks and layouts. By using one of our pre-defined starting architectures, such as the SFA 100, we can rapidly tailor this to create a unique, custom solution for each customer. Effectively we are re-using a framework or chassis and scalable entities such as cores that we have used before along with tools, flows, project management, etc. which reduces risk and, most importantly, time to silicon so that the customer can be fast to market with the AI empowered device.”
The SFA 100 uses an Arm® subsystem with a choice of Arm cores and the option of a security subsystem. Its low power requirement makes it the ideal platform for battery-powered edge AI applications such as smart home, smart factory, and sensor fusion devices. The device provides the ability to integrate a machine-learning engine supporting a variety of inference based ‘smarts’ such as voice activation, image classification, gesture recognition, filtering, etc. A radio subsystem such as a Bluetooth IP block or WiFi can also be added if required. Customer’s IP and any third-party IP can be included as Sondrel has the ability to wrap IP blocks so that they have all the necessary interfaces to just drop onto the chassis. More powerful solutions can be created by using the SFA 200 or SFA 300 as starting points.
The Edge AI market is predicted to expand at a CAGR of 33.5% to reach $76 billion by 2031 according to a report by Transparency Market Research. The key is the drive to process data locally and thus eliminate the latency from transmitting the data to a centralised cloud server for processing. Applications range from industry 4.0, where it is used to provide real-time decision making, to devices such as drones, smartphones, cars, etc.
Suggested Items
France, Spain Renew Commitment to the Airbus A400M Programme
06/17/2025 | AirbusAirbus and OCCAR have reached an agreement with the A400M launch nations to secure production for the programme for the foreseeable future, improve the cost of operations, and jointly develop new capabilities.
A.R.T. Ltd. Supports Release of IPC-A-600M
06/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T. Ltd.), a leading provider of IPC-certified training and IPC authorised distributor, announces the release and availability of IPC-A-600M, the latest revision of the industry’s definitive standard for printed board acceptability.
The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
06/18/2025 | Brittany Martin -- Column: The Marketing MinuteIn the competitive world of electronics, recognition isn’t given—it’s earned. With so many companies vying for attention, how do you ensure your brand voice stands out and stays top-of-mind? This month, I’m focusing on building recognition using three high-impact tools: social media, paid advertising, and thought leadership.
Zuken Vitech Announces GENESYS 2025: Advancing Interoperability and Usability in Model-Based Systems Engineering
06/10/2025 | ZukenZuken Vitech, a leading provider of model-based systems engineering (MBSE) solutions, is proud to announce the release of GENESYS 2025, the latest evolution of its flagship systems engineering platform.
Airbus Signs Contract to Equip German Air Force A400Ms with Infrared Protection Systems
06/09/2025 | AirbusAirbus has been awarded a contract from the German procurement agency Bundesamt für Ausrüstung, Informationstechnik und Nutzung der Bundeswehr (BAAINBw) to equip 23 Luftwaffe A400Ms with DIRCM protection systems.