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Connect With a New Job at JobCONNECT007 

09/10/2024 | I-Connect007 Editorial Team
jobCONNECT007 features job openings for positions that span the entire circuit board supply chain. Whether you’re involved in design, fabrication, assembly, test, or material development or distribution, this handy resource can help you find that new gig. Once you find a position that’s a perfect fit, you can submit your resume directly to the hiring manager simply by clicking on the ad.

American Standard Circuits to Exhibit at European Microwave Week 2024

09/09/2024 | American Standard Circuits
Anaya Vardya, President and CEO of American Standard Circuits announced that his company will be exhibiting at European Microwave Week 2024 to be held at the Paris Convention Center in Paris, France from September 22 through September 27, 2024.

Indium Experts to Speak on Sustainable e-Mobility and PCB Supply Solutions at Productronica India

09/09/2024 | Indium Corporation
Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.

DELO Proves Feasibility of Adhesives as Soldering Alternatives for MiniLEDs, Predicting Future MicroLED Integration

09/09/2024 | DELO
DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives.

Quiet Power: An Evolution in PCB Design Costs

09/04/2024 | Istvan Novak -- Column: Quiet Power
In this column, I want to cover my experiences, particularly where costs are concerned, with printed circuit boards from the 1960s to the present day. I grew up in an apartment building in downtown Budapest, where I began doing hobby projects building circuits from our kitchen table. Now, I’m lecturing about the most recent advances in signal integrity at Oxford University. We’ve come a long way. Over the decades, new technologies allowed users to have more layers, lower-loss dielectrics, fine-pitch surface connections, blind and buried vias, and HDI and HDI+ board constructions that allow us to design higher-performing systems. I expect this trend to continue.
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