Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Würth Elektronik Expands Its FPC Connector Family

10/30/2024 | Würth Elektronik
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger.

Intel Demonstrates Breakthroughs in Next-Generation Transistor Scaling for Future Nodes

12/11/2023 | Intel
Intel unveiled technical breakthroughs that maintain a rich pipeline of innovations for the company’s future process roadmap, underscoring the continuation and evolution of Moore’s Law.

ZESTRON’s Michael Kövi to Present at SMTAI 2019

09/17/2019 | ZESTRON
ZESTRON has announced that Michael Kövi, application engineer, ZESTRON Europe, will be presenting “Handling Technical Cleanliness in Electronic Production” at SMTA International. Kövi’s presentation will be on Thursday, September 26, during session MFX7 – Cleaning: Challenges.

Ultra-Clean Fabrication Platform Produces Nearly Ideal 2D Transistors

05/20/2019 | Columbia Engineering
An enhanced optical microscope image of a Hall-bar structure used to characterize transistor properties for devices made with ultraclean transferred contacts. The long radial lines, made from deposited gold, connect the small contacts at the center of the device to large probe pads for easy measurements.

Thin Films for More Efficient Solar Cells

10/08/2018 | KAUST
The efficiency of solar cells can be increased by thin-film contacts developed by researchers at KAUST.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in