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Advanced Electronics Packaging Digest

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Suggested Items

ITT Completes Acquisition of Aerospace Contacts LLC

07/08/2026 | BUSINESS WIRE
ITT Inc. today announced the completion of its acquisition of the privately held Aerospace Contacts LLC (Aerospace Contacts), a recognized manufacturer of critical, high-reliability precision contacts, for a purchase price of $31 million.

Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability

08/04/2025 | atg Luther & Maelzer GmbH
atg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.

Würth Elektronik Expands Its FPC Connector Family

10/30/2024 | Würth Elektronik
The selection of connectors for flat flexible cables (FFC) and flexible printed circuits (FPC) from Würth Elektronik is getting even larger.

Intel Demonstrates Breakthroughs in Next-Generation Transistor Scaling for Future Nodes

12/11/2023 | Intel
Intel unveiled technical breakthroughs that maintain a rich pipeline of innovations for the company’s future process roadmap, underscoring the continuation and evolution of Moore’s Law.

ZESTRON’s Michael Kövi to Present at SMTAI 2019

09/17/2019 | ZESTRON
ZESTRON has announced that Michael Kövi, application engineer, ZESTRON Europe, will be presenting “Handling Technical Cleanliness in Electronic Production” at SMTA International. Kövi’s presentation will be on Thursday, September 26, during session MFX7 – Cleaning: Challenges.
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