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The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
August 8, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.
“Our Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and even blog posts,” said Indium Corporation President and COO Ross Berntson. “It acknowledges team members for generating leading-edge research and thought leadership that addresses issues faced by customers in the electronics industry. This year’s honorees are particularly deserving of the well-earned recognition.”
Two papers and their authors were recognized this year. A Bismuth-Free In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305, co-authored by Hongwen Zhang, Tyler Richmond, Kyle Aserian, Huaguang Wang, Jie Geng, Chris Nash, and Jonas Sjoberg, was first presented at ECTC 2023. The paper examines a mixed solder powder paste technology used to develop a bismuth-free, indium-containing solder paste (MTS) for lower-temperature soldering. Additionally, a paper titled Energy Consumption Reduction Using Low-Temp Solder Alloys quantifies the effect of reduced temperature on oven energy usage by recording the consumption rate of an oven under various reflow conditions. Co-authored by Adam Murling and Jay Zhang, this presentation was first delivered at APEX 2023, based on their technical paper.
Ross encouraged the authors to continue sharing their knowledge through content creation by saying, “Technical content creation is extremely important for Indium Corporation. By sharing your expertise through whitepapers, you play a crucial role in disseminating knowledge to a global audience. This effort not only excites our customer base but also positions us as an industry leader, drawing new talent and fostering a culture of continuous improvement and learning. Your contributions enable us to advance semiconductor and electronics assembly and share industry-shaping knowledge. Keep up the fantastic work, and remember that your creativity and insights bring world-changing materials science to life.”
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