It’s Only Common Sense: Pricing PCBs? It’s All in Their Heads
Punching Out: Entrepreneurship Through Acquisition Buyers for PCB/EMS Shops
Driving Innovation: Mastering Panel Warpage
Indium Expert to Present on Solder Paste Solutions at SMTA Empire Expo and Tech Forum
September 29, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.
The presentation, Engineering Out Defects: Solder Paste Selection and Handling Best Practices, will focus on solder paste selection, storage, and handling best practices for printed circuit board (PCB) assembly, and will connect the principles to the defect mechanisms they influence. Each best practice is an opportunity to prevent defects and promote a robust assembly process.
“Reliable PCB assembly starts long before the first print,” said Burt. “From the time the paste is manufactured to the moment it’s put on the stencil, disciplined handling protocols preserve and optimize performance.”
Burt is based at Indium Corporation’s global headquarters in Clinton, New York. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation’s materials, as well as providing product and process training. Burt earned his bachelor’s degree in chemistry from Clarkson University, and he is a Certified SMT Process Engineer (CSMTPE).
The presentation will take place on Wednesday, October 1, at 11:00 a.m.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Experts to Present on Thermal Interface Materials at IMAPS Microelectronics Symposium
09/24/2025 | Indium CorporationIndium Corporation experts will deliver technical presentations on thermal interface materials (TIMs) at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Indium Promotes Huang to Senior Manager, Marketing Communications
08/28/2025 | Indium CorporationWith its commitment to innovation and growth through employee development, Indium Corporation announces the promotion of Jingya Huang to Senior Manager, Marketing Communications, to continue to lead the company’s branding and promotional efforts.