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Advanced Electronics Packaging Digest

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Bofeng, Foxconn Establish Renewable Energy Partnership in Vietnam

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Bofeng, a leading global investment firm, announced a strategic partnership with Foxconn Technology Group, the world's largest electronics manufacturer.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

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Powermat, Anker Innovations Announce Patent License Agreement and Strategic Collaboration

05/27/2026 | PRNewswire
Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, announced a patent license agreement and strategic collaboration between the parties to accelerate the next phase of wireless power adoption.

Northrop Grumman, TOCI Collaborate to Enhance Estonia’s Air and Missile Defense

05/20/2026 | Northrop Grumman
To address escalating regional security threats and reinforce Estonia’s national defense and readiness, Northrop Grumman and TOCI are signing a Memorandum of Understanding to collaboratively advance the country’s integrated air and missile defense (IAMD) systems.

Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.
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