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Advanced Electronics Packaging Digest

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DuPont Announces Collaboration with Microsoft and NobleAI to Accelerate R&D Innovation with AI

11/13/2026 | PRNewswire
DuPont announced a collaboration with Microsoft and NobleAI to expand access to advanced AI tools and resources, including machine learning that helps its scientists and engineers innovate faster.

CORSAIR PRO to Optimize Engineering Workstations, Servers and Clusters for Ansys Simulation

11/13/2026 | BUSINESS WIRE
Corsair Gaming, Inc., a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, performance PC builders, and SIM Racing enthusiasts, has joined the Ansys Technology Partner Program, part of Synopsys, to deliver HPC systems that accelerate and simplify deployments.

Altamira Awarded $63 Million NOVASTAR Contract

11/10/2026 | Globe Newswire
Parsons Corporation announced that Altamira, a Parsons company, was awarded a task order supporting the National Air & Space Intelligence Center (NASIC) to support the development, delivery, maintenance, sustainment, and enhancement of capabilities within the Collaboration Collection under the Services of Common Concern (SoCC).

Applied Materials to Increase its Strategic Investment in BE Semiconductor Industries

11/06/2026 | Applied Materials
 Applied Materials, Inc. announced it is increasing its investment in BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares. The share purchase would add to Applied Materials’ current investment in Besi, which Applied initially made in April 2025.

Intel, Oracle Expand Collaboration for Enterprise and Agentic AI on OCI

10/30/2026 | Intel
Intel and Oracle announced plans for a multiyear collaboration intended to expand Intel® Xeon®-based computing on Oracle Cloud Infrastructure (OCI).
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