Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Fujitsu, IBM Japan Partner to Accelerate Enterprise System Modernization

06/19/2026 | JCN Newswire
Fujitsu Limited and IBM Japan, Ltd. announced that they will accelerate their collaboration in the field of business system modernization in order to advance enterprise digital transformation and address challenges associated with legacy systems.

TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US

06/16/2026 | BUSINESS WIRE
Taiwan Semiconductor Manufacturing Company and Amkor Technology, Inc. announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.

Bofeng, Foxconn Establish Renewable Energy Partnership in Vietnam

06/10/2026 | Foxconn
Bofeng, a leading global investment firm, announced a strategic partnership with Foxconn Technology Group, the world's largest electronics manufacturer.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.

Powermat, Anker Innovations Announce Patent License Agreement and Strategic Collaboration

05/27/2026 | PRNewswire
Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, announced a patent license agreement and strategic collaboration between the parties to accelerate the next phase of wireless power adoption.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in