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Advanced Electronics Packaging Digest

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Powermat, Anker Innovations Announce Patent License Agreement and Strategic Collaboration

05/27/2026 | PRNewswire
Powermat Technologies, Ltd., a pioneer in wireless power and an early global commercializer of wireless charging solutions and Anker Innovations Co., Ltd., a world leader in consumer electronics, announced a patent license agreement and strategic collaboration between the parties to accelerate the next phase of wireless power adoption.

Northrop Grumman, TOCI Collaborate to Enhance Estonia’s Air and Missile Defense

05/20/2026 | Northrop Grumman
To address escalating regional security threats and reinforce Estonia’s national defense and readiness, Northrop Grumman and TOCI are signing a Memorandum of Understanding to collaboratively advance the country’s integrated air and missile defense (IAMD) systems.

Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

Sony Semiconductor Solutions, TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership

05/08/2026 | TSMC
Sony Semiconductor Solutions Corporation and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to form a strategic partnership for the development and manufacturing of next-generation image sensors.

Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative

04/29/2026 | Global Electronics Association
The Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
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