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proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

09/04/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of proteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems.

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power Innovation

09/04/2026 | Siemens
Siemens announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives.

HUMAIN, Compal Partner to Expand Cloud-to-Edge AI at LEAP 2026

09/01/2026 | Compal Electronics Inc.
As artificial intelligence rapidly expands beyond centralized cloud computing into real-world applications, HUMAIN has selected Compal Electronics as its long-term strategic ODM partner to support the development and manufacturing of its next-generation AI infrastructure and intelligent computing platforms.

Infineon, Tack One Win SICC Award for Best Technological Collaboration

08/31/2026 | Infineon
Infineon Technologies Asia Pacific Pte Ltd and Tack One Pte Ltd have been recognized by Singapore International Chamber of Commerce (SICC)  as the winner of the “Best Technological Collaboration” category and as a finalist in the “Most Sustainable Collaboration” category at the 2026 SICC Awards ceremony, for their partnership in developing FloodFinder™, a smart urban flood monitoring system.

BAE Systems, TUALCOM to Collaborate on Autonomous Technologies

08/16/2026 | BAE Systems
The UK’s biggest defence company has signed a Memorandum of Understanding (MoU) with TUALCOM to explore collaboration on technologies that will enable the next generation of autonomous air capabilities to thrive in the modern battlespace.
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